I am interested in becoming custom Layout engineer as well as ASIC backend.I understand my role includes:
ASIC backend --Floor planning, Placement,Clock tree synthesis,routing,Physical verification -Design rule check,Layout vs schematic and Parasitic extraction,Back annotation Static timing analysis,tape out GDS-ll .
Layout -Layout construction,Design rule check,Layout vs schematic,Parasitic extraction,
Schematic Back annotation, Re simulation,chip or module ok.
Physical design comes after the front end which includes from system specification to functional design where we generate gate level netlist mapped to standard cell library.Physical design and beyond forms the back end flow.
Layout is done once circuit is simulated ,its functionality is verified and whether the functionality is what is intended ,and should meet the specifications.
Monday, March 29, 2010
What is an integrated circuit?
Integrated circuit is a miniaturized electronic circuit consisting of semiconductor devices as well as passive components that has been fabricated on thin substrate of semiconductor material.
Now what is a substrate?
In semiconductor device fabrication, substrate is a wafer.With respect to material sciences , any coating that is applied to surface of the object is called substrate.
wafer is a thin silica crystal ,used in semiconductor device fabrication.
What is die?
Each device is tested before packaging using automated test equipment (ATE), in a process known as wafer testing, or wafer probing. The wafer is then cut into rectangular blocks, each of which is called a die. Each good die (plural dice, dies, or die) is then connected into a package using aluminium (or gold) bond wires which are welded and/or Thermosonic Bonded to pads, usually found around the edge of the die. After packaging, the devices go through final testing on the same or similar ATE used during wafer probing.
Now what is a substrate?
In semiconductor device fabrication, substrate is a wafer.With respect to material sciences , any coating that is applied to surface of the object is called substrate.
wafer is a thin silica crystal ,used in semiconductor device fabrication.
What is die?
Each device is tested before packaging using automated test equipment (ATE), in a process known as wafer testing, or wafer probing. The wafer is then cut into rectangular blocks, each of which is called a die. Each good die (plural dice, dies, or die) is then connected into a package using aluminium (or gold) bond wires which are welded and/or Thermosonic Bonded to pads, usually found around the edge of the die. After packaging, the devices go through final testing on the same or similar ATE used during wafer probing.
Why Integrated Circuit?
What i understand by integrated circuit is connect all the electronic devices placing closer to each other and put it on one substrate.
Why not discrete?
Cost,Speed,Area are the features what today we look at.We need less area,more speed and less cost.
Manufacturing discrete components(single transistor at a time) is costlier than what we can manufacture on single substrate, i.e., printed as a unit by photo lithography.
Cost is less
Placing devices closer to each other improves the performance,devices switch quickly ,as they are smaller and closer.
Why not discrete?
Cost,Speed,Area are the features what today we look at.We need less area,more speed and less cost.
Manufacturing discrete components(single transistor at a time) is costlier than what we can manufacture on single substrate, i.e., printed as a unit by photo lithography.
Cost is less
Placing devices closer to each other improves the performance,devices switch quickly ,as they are smaller and closer.
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